Set micro-network news (text / small Ru) Recently, Shenzhen City officially issued the "Five-Year Action Plan for Further Promoting the Development of Integrated Circuit Industry (2019-2023)" and "Several Measures on Accelerating the Development of Integrated Circuit Industry" Important documents, Shenzhen plans to build an internationally competitive integrated circuit industry cluster by 2023, and to scale up the industry. Among them, the completion of chip manufacturing and the lack of advanced packaging and testing are listed as one of the main tasks.
The Action Plan proposes that by 2023, the overall sales revenue of Shenzhen's industry will exceed 200 billion yuan, the sales revenue of the design industry will exceed 160 billion yuan, and the sales revenue of the manufacturing industry and related links will reach 40 billion yuan. Introduced and cultivated 10 key enterprises with sales income of more than 2 billion yuan.
The main task is to introduce a chip manufacturing production line. Positioning 28 nanometers and below of advanced manufacturing processes and high-end features such as RF, power, sensors, display drivers, etc., strengthen cooperation with leading IC manufacturers in the world, and invest in the construction of 1-2 8-12 inch production lines. And enhance the competitiveness of high-end chip design industry, and accelerate the cultivation of third-generation semiconductors.
Advancing core key technology breakthroughs will focus on the fabrication of node chips at 14nm, 10nm and below.
"Several Measures" have proposed relevant incentives and subsidies for integrated circuit companies in support of sound improvement of the industrial chain, support for core technology research, support for the development and application of new technologies and new products, support for increased investment and financing, and support for industrial talents. .
The annual operating income of Shenzhen IC companies exceeded 100 million yuan, 300 million yuan, 500 million yuan, 1 billion yuan and 2 billion yuan for the first time, giving the core team of enterprises 1 million yuan, 2 million yuan, 3 million yuan and 4 million yuan respectively. A one-time reward of 5 million yuan will be awarded once every step.
The unit (or consortium) that undertakes and completes the core technology breakthrough task grants up to 50% of the technology research and development expenses. For the highest scientific and technological awards in the country, a one-off award of 10 million yuan will be given to the winners; winners of the National Natural Science Award, the National Technology Invention Award, the National Science and Technology Progress Award, the first prize, the second prize or The lead implementation unit will give a one-time award of 3 million yuan, 2 million yuan and 1 million yuan respectively.
In addition, it provides EDA (Electronic Design Automation) tools and IP (Intellectual Property) cores, design solutions, advanced process tapes, advanced packaging and testing services, test and verification equipment, etc. for integrated circuit design, manufacturing, and packaging and testing public service platforms. In Shenzhen enterprises to carry out high-end chip research and development support services, one-time grant of 20% of the actual construction of the platform, the maximum amount of funding is not more than 30 million yuan. According to the situation of the platform operation service, 10% of the main business income will be rewarded, and the maximum amount will not exceed 10 million yuan per year.
For design companies that use multi-project wafers for R&D, grant multi-project wafer direct flow costs up to 70% and annual totals of no more than $3 million. For enterprises that have completed the first full-mask project product stream, they will be given a subsidy of up to 50% of the cost of the film and an annual total of not more than 5 million yuan.
For integrated circuit design companies to purchase EDA design tool software, 20% of the actual expenses will be used for funding. The total annual amount of each enterprise shall not exceed 3 million yuan. For enterprises to purchase IP to carry out high-end chip research and development, give IP purchase the actual payment of up to 20% of the funding, the total amount of a single enterprise does not exceed 5 million yuan per year. For companies engaged in the development of integrated circuit EDA design tools, R&D funding for EDA research and development is up to 30% per year, totaling no more than 30 million yuan.
For Shenzhen enterprises to sell chips designed and developed independently, and the sales amount of single chip products exceeds 5 million yuan, rewards are up to 10% of the sales amount of the year, and the total annual award of single chip products does not exceed 5 million yuan. Supporting Shenzhen enterprises to sell key integrated core equipment and materials for independent research and development, according to the highest 30% of the sales amount, one-time award of no more than 10 million yuan.
The Measures also encourage integrated circuit companies to raise funds through direct financing such as listing, acquisition of holding listed companies, and listing of the New Third Board, and granting a maximum of no more than 10 million yuan in phases. If it is reported to the Shenzhen Securities Regulatory Bureau for counseling and obtaining a record of filing, it shall be granted a maximum of no more than 1 million yuan; if the application materials for the initial public offering are formally accepted by the China Securities Regulatory Commission, it shall be granted a maximum of no more than 3 million yuan; the initial public offering of shares, and In the domestic A-share listing, the maximum amount of subsidy is not more than 6 million yuan; if it is successfully listed on the New Third Board, it shall be given a maximum of no more than 2 million yuan; if it is listed on the overseas exchange and is listed for the first time, it shall be given a maximum of 3 million yuan. Yuan funding.
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